Products


Heat Activated Tapes for Dual Interface Chip Bonding

Heat Activated Tapes for Dual Interface Chip Bonding image

When manufacturing Dual Interface or Non-contacted Cards, many manufacturers use the conductive paste to bond the flip chip. 

Using electrically conductive heat-activated films (or anisotropic conductive films - ACF) for bonding the chip module, PPI Adhesive Products offers an alternative to the paste or glue, reducing the processes involved in manufacturing and thus increasing efficiency.

Our conductive heat-activated tapes offer potentially higher productivity than conductive glue or paste, ensuring a secure connection of the antenna and chip module, and providing you with higher flexibility. 

RD – 1054B/ RD – 1054C these products have a stable conductivity based on an electrically conductive thermoplastic adhesive supplied on a siliconised paper interliner. The products are colourless and suitable for bonding PVC & ABS materials.